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Sr. Mechanical Engineer
Digital Optics Corporation • October 2011 - present
• Senior Module-Level ME for Third Generation MEMS based high-resolution auto-focus camera modules for mobile devices. Extremely tight deadlines, with product timelines in the 3-6 month range. • Responsible for top level full-module assembly design. Designing for internal R&D proof-of-concept cameras as well as Customer-facing programs delivering cameras tailored to meet customer specifications. • Designing at the leading edge of camera module technology, utilizing novel lens designs, unique assembly methods, and proprietary MEMS actuators. • Up-front collaboration with design with Japanese lens vendor to optimize optical quality, minimize module size, and maximize assembly yield. • Frequent travel to Japan for design reviews with customers and design partners. • Extensive design optimization through statistical tolerance analysis, DFM, DFA, FMEA, & FEA (structural and thermal) • Close work with EE team to reduce product size through the use of advanced packaging techniques, flip-chip design, ceramic substrates, Rigid-Flex as well as FPC with ACF attach. Patent filed.
Sr. Mechanical Engineer
FrontRow • June 2007 - October 2011
• Sole ME for FrontRow, in charge of all mechanical designs and specifications, cosmetic specification, reliability specification and test procedures. Emphasis on low cost, high quality, long life products. • Managed mechanical aspects of component selection and validation, NPI, post-launch design revisions, continuing cost-down efforts. • Tight integration with over-seas manufacturing and design, including frequent overseas travel to China and Taiwan • Daily co-design with EE teams to minimize product size while maximizing assembly simplicity and yield. • Recognized for relationship building and developing rigorous documentation procedures with contract design partners and reliability testing labs
Sr. Mechanical Design Engineer
Flextronics Camera Module Group (VistaPoint Technologies) • November 2005 - June 2007
• Lead ME for First Generation MEMS based high-resolution auto-focus camera modules for mobile phones. Managed camera module design from inception through to high volume production. • Developed designs focused on very tight packaging and extremely close tolerances in order to meet market demand for multi-megapixel cameras in tiny sizes. Part tolerances in ±10 micron range. • Extensive part and assembly level tolerance analysis and statistical yield calculations. • Close collaboration with multinational factories and vendors to optimize designs for high volume production. • Extensive work with local rapid prototyping and machining vendors.
Mechanical Design Engineer
Flextronics Design (San Diego and San Jose) • August 2002 - August 2005
• Designed injection molded plastic parts for high volume production. • Worked in close collaboration with industrial design, manufacturing, supply chain, and prototype shops. • Duties included Reliability test plan design and administration. • Projects include: Mobile phone camera modules, wall-mounted telecom battery back-up unit, handheld glucose monitor and painless lancing device.
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San Diego State University
Bachelor of Science, Mechanical Engineering
Santa Rosa Junior College
Associates Degree, Physics