How to represent BGA's Balls Model?
Which is the best way to 3d model that Electronic Package, specifically the Balls, show them as it will be mounted, deformed on the PCB or rounded?
This question is determined by the ball size, pad size, and thickness of solder paste before reflow. The amount of solder will reflow with the ball to create a pillar of solder between the PCB pad and the IC package pad.
The height of IC from PCB is dependent on total solder volume between PCB pad and IC pad. The ball should not deform too much, but bond with the paste.
here's an x-ray inspection photos after reflow for reference :