Models
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Work experience
Provide technical expertise to lead the organization in process development implementation, process
engineering, CAD designs and simulations, and maintenance engineering of manufacturing processes of surface mount and/or through-hole printed circuit board (PCB) assemblies.
Acted as carrier tape, POD and cad documentation Specialist covering WLP (Wafer Level Packaging), Die Sales in order to support production assembly.
Education
Mechanical Technology
BS Mechanical Engineering
