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Sergey Prokopenko
Schematic and PCB designer
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Ukraine
Models
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Models
97
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Following
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Models
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TOP-3
3D models for TOP-3 (BTA25, BTA41 and other triacs) with different options of lead forming.
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49
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TO-3PN and SC-65
3D models for few option of lead forming packages TO-3PN (TO-3P-3L) and SC-65 (TO-3P-3LD)
5
121
0
TO-220
3D models for 2 and 3 pins TO-220 with different options of lead forming.
13
193
0
ITO-220 (TO-220PF) - isolated TO-220
Few lead forming options for isolated TO-220 package. All vertical mounted options optimized for 18 mm distance between package mounting hole and ...
11
227
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TO-3PF
3D model for TO-3PF package . Available 4 options: long legs (non cut) and 3 variants cutted legs for different distance between package mounting h...
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34
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QFN20 5x5 NDP1460QB
3D model of package DC-DC converter NDP1460QB: https://www.lcsc.com/product-detail/DC-DC-Converters_span-style-background-color-ff0-NDP-span-NDP14...
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55
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BTA100-800B
3D model of package high power TRIAC BTA100-800B with 3 options lead forming.
2
34
0
QFN20_3x4mm MPQ4470
3D model for MPQ4470GL / MPQ4470AGL DC-DC converter.
1
22
0
ASFJ-3262 (SOP24/18P0.8)
Package for ACFJ-3262 (10A dual-channel gate drive optocoupler device) - SOP-24 package with pitch 0.8 mm, designed for high voltage, space constra...
2
30
0
UFDFN8 (STDFN8L - Renesas)
Package for SLG59M1563V - 22.5 mOhm 2.5 A ultra small load switch (1.0x1.6x0.55mm)
2
26
0
QFN-12L_MPM3810
DC-DC converter with integrated inductor.
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29
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EQFN14-D7
Case used for RF switch NJG1681MD7
2
19
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MPLD10
Case used for RF switch SKY13322-375F
2
18
0
QFN-20_MP3632C
3D model of package used for MP3632CC step-down DC-DC converter with integrated inductor
3
28
0
QFN-13_MP2491C
3D model of package used for MP2491C step-down DC-DC converter
3
26
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QFN-14_MP3424
3D model of package used for MP3424 step-up DC-DC converter
3
35
0
PQFN8_56 (CASE483AT)
3D model of package used for FDMD8560L and other Onsemi (Fairchild) half-brodge MOSFET arrays
3
22
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DFN8_DC56 (CASE506EG)
3D model of Dual Cool DFN56 case used for FDMS86300DC MOSFET
2
36
0
WQFN12 (CASE510CJ)
3D model for package used in some half-bridge MOSFET arrays from Onsemi. Model based on 510CJ.pdf from company website.
2
22
0
TCPAK10_5.1x7.5
3D model for package used for some new Onsemi automotive MOSFETS: https://www.onsemi.com/products/discrete-power-modules/mosfets#products=fi0xMX52Y...
4
26
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TDFNW8
3 options of 8x8 mm SMD packages used Onsemi corp. for power MOSFETs. 3D models based on datasheets from Onsemi website.
6
55
0
PowerPAK SO-8DC
Thin (0.56 mm) PowerPAK SO-8DC (DC - Double Cooling) package used in SiDR680DP and some other MOSFETs from Vishay Siliconix company. This package c...
5
63
0
FSFR (CASE127EM)
3D model for FSFR2100XS from Onsemi company. Model based on 127EM.pdf from Onsemi website.
4
28
0
Tact switches 12x12xXX
3D models for tact switches 12x12 with heights 4.3 and 5 - 18 mm with step 1 mm
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