Mitchell Burko

5

followers

syracuse ny, United States

Models

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TSSOP/ SSOP/ TSOP/ SOIC/ SOP/ SOJ/ SMT parametric land pattern
Parametric IC land pattern. Default is TSSOP-16. SW2012 version. Edit SW Equations to change Pitch, Pin Count. Row to Row. Pad size.
6 164 0
8 pin SO to DIP adapter for electronic components. PA-SOD3TH18-08
8 pin SO to DIP adapter for electronic components. SO Land pattern accepts: 0.050" pitch, 0.220" to 0.405" lead span. DIP Plug has 0.018" dia p...
18 418 3
14 pin SO to DIP adapter for electronic components. PA-SOD3SM18-14
14 pin SO to DIP adapter for electronic components. SO Land pattern accepts: 0.050" pitch, 0.220" to 0.405" lead span. DIP Plug has 0.018" dia ...
12 351 0
8 pin SSOP/ MSOP/ TSSOP to DIP adapter for electronic components, PA-SSD3SM18-08
SSOP, TSSOP, and MSOP Land pattern accepts: 0.65mm pitch, 3.5mmm to 9.0mm lead span. DIP Plug has 0.018" dia pins. Row to Row is 0.300" and 0.10...
15 558 2
20 pin SO to DIP adapter for electronic components. PA-SOD3SM18-20
20 pin SO to DIP adapter for electronic components. SO Land pattern accepts: 0.050" pitch, 0.220" to 0.450" lead span. DIP Plug has 0.018" dia ...
7 130 4
16 pin SO to DIP adapter for electronic components. PA-SOD3SM18-16
16 pin SO to DIP adapter for electronic components. SO Land pattern accepts: 0.050" pitch, 0.220" to 0.405" lead span. DIP Plug has 0.018" dia ...
7 299 2
8 Pin SOIC to DIP adapter for electronic components, PA-SOD3SM18-08
8 pin SO to DIP adapter for electronic components. SO Land pattern accepts: 0.050" pitch, 0.220" to 0.450" lead span. DIP Plug has 0.018" dia...
15 345 3
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